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Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.
Hybrid Assemblies and Multichip Modules
Language: en
Pages: 296
Authors: Fred W. Kear
Categories: Technology & Engineering
Type: BOOK - Published: 2020-07-25 - Publisher: CRC Press

Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides
Hybrid Assemblies and Multichip Modules
Language: en
Pages: 296
Authors: Kear
Categories: Technology & Engineering
Type: BOOK - Published: 1992-12-16 - Publisher: CRC Press

Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides
Precision Assembly Technologies and Systems
Language: en
Pages: 346
Authors: Svetan Ratchev
Categories: Computers
Type: BOOK - Published: 2010-02-06 - Publisher: Springer

The development of new-generation micro-manufacturing technologies and systems has revolutionised the way products are designed and manufactured today with a s- nificant impact in a number of key industrial sectors. Micro-manufacturing techno- gies are often described as disruptive, enabling and interdisciplinary leading to the creation of whole new classes of
Product Design for Manufacture and Assembly
Language: en
Pages: 712
Authors: Geoffrey Boothroyd, Peter Dewhurst, Winston A. Knight
Categories: Science
Type: BOOK - Published: 2010-12-08 - Publisher: CRC Press

Hailed as a groundbreaking and important textbook upon its initial publication, the latest iteration of Product Design for Manufacture and Assembly does not rest on those laurels. In addition to the expected updating of data in all chapters, this third edition has been revised to provide a top-notch textbook for
Flat Rolling Fundamentals
Language: en
Pages: 850
Authors: Vladimir B. Ginzburg, Robert Ballas
Categories: Technology & Engineering
Type: BOOK - Published: 2000-06-30 - Publisher: CRC Press

This volume compiles information from physics, metallurgy, and mechanical and electrical engineering to epitomize the fundamental characteristics of flat rolling steel. Flat Rolling Fundamentals is drawn from in-depth analyses of metal properties and behaviors to technologies in application. The book provides a full characterization of steel, including structure, chemical composition,